< PreviousField Device Integration (FDI) – Part 4: FDI Packages RELEASED FCG TS62769-4 , Ed. 1.2.0, 21 Jun 2019 Page 79 of 79 Bibliography IEC 61784-1, Industrial communication networks – Profiles – Part 1: Fieldbus profiles IEC 61784-2, Industrial communication networks – Profiles – Part 2: Additional fieldbus profiles for real-time networks based on ISO/IEC 8802-3 FCG TS61804-5, Function blocks (FB) for process control and Electronic device description language (EDDL) – Part 5: EDDL Builtin library IEC 62591, Industrial communication networks – Wireless communication network and communication profiles – WirelessHART FCG TS62769-1, FDI Project Technical Specification – Part 1: Overview FCG TS62769-2, FDI Project Technical Specification – Part 2: FDI Client FCG TS62769-3, FDI Project Technical Specification – Part 3: FDI Server FCG TS62769-4, FDI Project Technical Specification – Part 4: FDI Packages FCG TS62769-5, FDI Project Technical Specification – Part 5: FDI Information Model FCG TS62769-6, FDI Project Technical Specification – Part 6: FDI Technology Mapping FCG TS62769-7, FDI Project Technical Specification – Part 7: FDI Communication Devices NE107, Self-Monitoring and Diagnosis of Field Devices <available at www.namur.de> Next >